作者：Zachary I. Green;Xichong Chen;Alexander G. Papastrat;Lijun Zou;Mitchell Anthamatten;
作者單位：Department of Chemical Engineering, University of Rochester 206 Gavett Hall, Rochester, NY 14627 (USA);Department of Chemical Engineering, University of Rochester 206 Gavett Hall, Rochester, NY 14627 (USA);Department of Chemical Engineering, University of
刊名：Chemical vapor deposition
ISSN：0948-1907
出版年：2009-01-05
卷：15
期：41005
起頁：106
止頁：111
分類號：TQ175
語種：英文
關鍵詞：Metal/polymer composites;Morphology;Polyimides;Thin films;Vapor deposition;
內容簡介A vapor deposition polymerization technique is applied to grow composite films containing polyimide and copper phthalocyanine (CuPc). Specifically, 4,4(-oxydianiline and 3,3(,4,4(-biphenyl tetracarboxylic dianhydride are co-evaporated in the presence of CuPc. Spectroscopy experiments confirm the formation of polyimide segments and suggest that embedded CuPc molecules have less mobility than pure CuPc films. Electron microscopy and X-ray diffraction (XRD) studies show that the majority of CuPc initially assumes an amorphous phase. Upon curing, partial crystallization of CuPc occurs, forming small crystals (a phase) that are suspended in a polyimide matrix. These crystals exhibit enhanced thermal stability compared to pure vapor-deposited CuPc.
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